Diamond/Copper Composite materials are formed by combining diamond with copper matrix. The material is characterised by high thermal conductivity and low expansion, which can significantly improve the heat dissipation environment and significantly increase the reliability and stability of the device when applied to the heat sinking of high-power electronic components. Moreover, by designing the diamond composition and morphology, the thermal conductivity and expansion coefficient of the material can be designed and adjusted to suit different specific application scenarios.
| Properties | |
| Thermal Conductivity | 650-800 W/mK |
| Specific Heat Capacity | 1.9 J/cm³K |
| Thermal Expansion Coefficient | 4.5-8 ppm/K(adjustable) |
| Density | 5.6 g/cm³ |
| Surface Modification | Chrome, Nickel |
| Contact Layer | Gold |
| Process Standard | |
| Crystallographic Orientation | 100 110 111 |
| Miscut for Main Face Orientation | ±3° |
| Product Size | Within 30mm×30mm×12mm |
| Transverse Tolerance | ±0.05mm |
| Thickness Tolerance | ±0.1mm |
| Surface Roughness | ＜10nm |
| Edge Cutting | Laser Cutting |
White and fancy color lab-grown diamonds in various sizes and shapes;
Offered as certified/uncertified stones, matched pairs, and calibrated parcels.
As a leading CVD lab-grown diamond producer, Crysdiam is providing high-quality products used in jewelry industry and various high-tech fields.
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