Diamond has very high thermal conductivity and is considered to be an ideal thermal management material (including heat sinks, encapsulation materials, substrate materials, etc.) and is well suited for high power RF, optoelectronic and high voltage power semiconductor devices. Currently, we can provide 2.5 inch diameter homogeneous epitaxial single crystal diamond thermal management materials.
Properties | |
Volume Resistivity (Rv) | 1×1012 Ω·cm |
Surface Resistivity (Rs) | 1×1010 Ω·cm |
Thermal Conductivity | >2000 W/mK |
Thermal Diffusivity | >11.1 cm2/s |
Thermal Expansion Coefficient | 1.0±0.1 ppm/K |
Process Standard | |
Crystallographic Orientation | 100 110 111 |
Miscut for Main Face Orientation | ±3° |
Common Product Size |
5mm×5mm×0.5mm 10mm×10mm×0.5mm 15mm×15mm×0.5mm |
Transverse Tolerance | ±0.05mm |
Thickness Tolerance | ±0.1mm |
Surface Roughness | <10nm |
Edge Cutting | Laser Cutting |
White and fancy color lab-grown diamonds in various sizes and shapes;
Offered as certified/uncertified stones, matched pairs, and calibrated parcels.